Overview
The Datacon 2200 EVO is a high-performance, multi-functional data logger and telemetry device designed for various industrial and commercial applications. It's a popular choice in Kenya and other parts of Africa due to its reliability, flexibility, and cost-effectiveness.
Key Features
Technical Specifications
Manual PDF Availability
You can download the Datacon 2200 EVO manual PDF from the manufacturer's website or through online repositories. Some popular websites to find the manual include:
Datacon 2200 evo is a high-accuracy, multi-chip die bonder engineered by
(BE Semiconductor Industries) for high-precision electronics manufacturing. It is widely used for die attach and flip-chip applications, offering a placement accuracy of up to in its advanced configurations. Key Technical Specifications
The Datacon 2200 evo is designed for maximum production flexibility on a single platform:
Standard high-accuracy multi-chip die bonding, with advanced models reaching ±3µm @ 3 Sigma Supports up to 12-inch wafer handling Features an automatic tool changer
and integrated dispenser to handle various process steps without manual intervention. Versatility: Capable of handling Multi Module Attach
, asphalting different technologies on one tried-and-tested platform. Operational Resources & Manuals For technical staff or procurement in
looking for documentation, several specialized manuals exist: Product Overview:
A comprehensive summary of features, including its thermal compensation algorithms and new camera systems for long-term stability, can be found on Besi's Official Product Page SECS/GEM Interface Manual:
Essential for factory automation, detailing communication protocols between the equipment and host computer (e.g., SECS-I, HSMS, and GEM standards). User Guides: datacon 2200 evo manual pdf kenya
Detailed technical brochures and catalogs (typically 2–4 pages) outlining specific operational capabilities are hosted on platforms like DirectIndustry Acquisition in Kenya
While Besi operates globally, regional support for high-end semiconductor equipment in East Africa typically involves international distributors or direct contact with Besi’s European or Asian headquarters. PDF Access:
Manuals are often restricted to registered customers; however, technical overviews and interface documentation are frequently archived on academic and industrial PDF repositories. or a direct contact for a quote for this equipment in the East African region? Datacon 2200 evo - Product details | Besi
The Datacon 2200 EVO is a high-precision, multi-chip die bonder manufactured by BE Semiconductor Industries (Besi) . It is widely recognized as a benchmark platform for Multi-Module Attach (MMA) applications, offering exceptional flexibility for both die attach and flip-chip processes.
For professionals in Kenya’s growing electronics and industrial automation sectors, obtaining the correct manual and technical documentation is critical for maintaining high-end semiconductor assembly equipment. Key Specifications of the Datacon 2200 EVO
The platform is designed to handle complex assembly tasks, such as System-in-Package (SiP) and multi-chip module production. Specification Placement Accuracy
± 10 µm @ 3s (Standard), ± 7 µm (Plus), ± 3 µm (Advanced) Rotational Accuracy ± 0.15° (Standard) to ± 0.07° (Advanced) Bond Force
Programmable from 0.5 N to 75 N (up to 500 N for the HF model) Wafer Handling Supports 4" to 12" wafers (up to 300 mm) Throughput Up to 7,000 UPH (Standard) and 12,000 UPH (HS version) Tooling Automatic tool changer with up to 14 pick & place tools Obtaining the Datacon 2200 EVO Manual (PDF)
While full technical manuals are typically restricted to registered customers, several resources provide essential operational and technical data: Datacon 2200 evo plus - Product details | Besi
Unlike consumer electronics manuals, OEM (Original Equipment Manufacturer) documentation for industrial pick-and-place equipment is often locked behind registration walls or service contracts. Kenyan users face specific challenges:
So, how does a Kenyan engineer get the authentic Datacon 2200 Evo manual PDF?
Kenya is steadily positioning itself as an East African hub for electronics assembly and repair. Companies refurbishing mobile phones, assembling smart meters, or manufacturing LED lighting rely on precision die bonders like the Datacon 2200 EVO. The machine’s ability to handle ultra-thin chips and delicate substrates makes it invaluable for:
But when an error code appears on the HMI (Human-Machine Interface) or a calibration issue arises without immediate OEM support in Kenya, the operational manual becomes the most critical tool in the room.
Since a genuine manufacturer’s site doesn’t exist for “Datacon 2200 EVO,” you can: Overview The Datacon 2200 EVO is a high-performance,
Final line: The “Datacon 2200 EVO manual PDF” in Kenya is a functional but flawed document for a low-end cable tester. It is not a professional reference, but it can work if you already understand TDR principles. For critical infrastructure (Safaricom fiber, KPLC secondary substations), demand a certified instrument with a proper manual – or hire a firm with a Fluke.
Searching for a Datacon 2200 Evo manual in Kenya involves accessing resources from the manufacturer, Besi, as physical copies or localized downloads are typically managed through their global customer support portals. Where to Find the Datacon 2200 Evo Manual Besi Official Support (Global)
: The most reliable source for technical manuals and documentation is the Besi Customer Area
. You will likely need a professional login assigned by their customer support to access full operation manuals. DirectIndustry Catalogs
: You can view and download technical brochures and data sheets for the Datacon 2200 Evo Advanced Datacon 2200 Evo Plus which provide key specifications. Technical Overviews
: For a feature-rich overview that covers machine highlights and SiP specific features, you can refer to community-shared documents like the Besi Datacon 2200 EVO Features Overview on Scribd Key Specifications for Reference
If you are looking for specific technical details normally found in the manual, here are the core capabilities of the Datacon 2200 Evo: placement accuracy for advanced models.
: Supports die sizes from 0.17 mm to 50 mm and thicknesses from 0.05 mm to 7 mm. Working Area
: Maximum substrate working area of 13” x 8” (325 mm x 200 mm). bond head rotation with an optional heated head. Versatility
: Designed for Multi-Module Attach, Flip Chip, and SiP applications. Manufacturer Contact for Local Assistance
Since there is no dedicated Besi office in Kenya, localized support for the East Africa region is often handled through their APAC or European headquarters . You can reach out to their global sales team at sales@besi.com
to request a localized service partner or the specific PDF manual for your serial number. Messe Frankfurt for machine maintenance, or just the technical data sheet for equipment specifications? Datacon 2200 evo advanced - Product details | Besi
No. The official manual is in English. However, many Kenyan technical colleges offer Swahili cheat sheets derived from the original PDF.
A: No. The Datacon 2200 Evo has unique closed-loop bond force control and specific wafer mapping protocols. Using generic instructions can damage the precision motors. Multi-Protocol Support : The Datacon 2200 EVO supports
One of the most critical features detailed in the Datacon 2200 EVO manual—and a primary reason for its popularity in Kenya—is the Moisture Balance Calibration feature. This is particularly vital for Kenyan farmers and grain aggregators trading with the East African Community (EAC) or exporting to international markets.
How the Feature Works: According to the manual, the Datacon 2200 EVO allows users to select specific "Product Curves" (mathematical formulas used to measure moisture in specific grains). However, the standout feature is the ability to adjust the Offset/Bias settings.
Why this matters in Kenya:
Availability of the PDF in Kenya: For Kenyan technicians and agro-dealers, accessing the PDF manual is often necessary to unlock these advanced calibration menus, which are password-protected or hidden to prevent accidental data corruption. The manual is typically distributed by authorized agricultural equipment suppliers in Nairobi (Industrial Area) or Eldoret, and digital copies are often required to train county agricultural officers on correct usage.
The DataCon 2200 EVO is likely a data center or server-related product, given the "DataCon" name. If you're seeking a manual or specifications for this product, I can offer some general guidance:
Manufacturer's Website: The best place to start is usually the manufacturer's official website. Look for the "Support" or "Downloads" section, where you might find manuals, datasheets, or firmware updates for the DataCon 2200 EVO.
Online Forums and Communities: Websites like Reddit, ServerFault, or DataCenter Knowledge forums might have discussions or posts about the DataCon 2200 EVO. Users often share manuals, experiences, or point to where these documents can be found.
Document Search Engines: Utilize document search engines or databases like ManualsLib, ManualsOnline, or even Google's advanced search feature to look for the specific manual.
Local Distributors in Kenya: If the product is available in Kenya, local distributors or resellers might have more specific information or the manual you're looking for. Their websites or customer service could be a valuable resource.
Product Review Sites: For reviews, consider tech news websites, data center equipment review platforms, or IT equipment comparison sites. These might offer insights into the product's performance, though specific reviews of the DataCon 2200 EVO might be scarce.
If you have any more details about the product, such as its application (data center, server, storage), or if there are specific aspects you're interested in (performance, features), I can try to offer more targeted advice or information.
The Datacon 2200 evo is a high-accuracy, multi-chip die bonder from BE Semiconductor Industries (Besi) featuring placement accuracy up to ± 7 µm, a maximum throughput of 7,000 UPH, and a bonding force of 0.5N to 75N. The system supports die sizes ranging from 0.17 mm to 50 mm, featuring an automated tool changer and support for 8" to 12" wafers. For official documentation and technical specifications, visit Besi. Datacon 2200 evo - Product details | Besi
Several industrial tech libraries host legacy and current manuals. When searching for "datacon 2200 evo manual pdf kenya," look for:
Caution: Always scan downloaded PDFs with an antivirus before opening on a factory network.