60352-5 Pdf — Iec

IEC 60352-5 standard, officially titled "Solderless connections - Part 5: Press-in connections," provides the general requirements, test methods, and practical guidance for solderless press-fit terminations used in electrical and electronic equipment. iTeh Standards The most recent version is the fifth edition (IEC 60352-5:2020) , which was published in July 2020. IEC Webstore Core Content & Scope

The standard focuses on connections where a termination with a specific "press-in zone" is inserted into a hole on a board, creating an electrically stable and mechanically sound joint without the use of solder. iTeh Standards Broadened Scope:

The 2020 edition expanded beyond just printed circuit boards (PCBs) to include various board materials, such as metal boards. Suitability Assessment:

It establishes how to determine connection reliability under specified mechanical (vibration, force), electrical (contact resistance), and atmospheric (climatic aging) conditions. Standardized Testing:

Provides a means of comparing results even when using tools from different manufacturers. IEC Webstore Key Technical Requirements Requirement Details Mechanical Procedures for measuring press-in force push-out force

. The 2020 edition added requirements for documenting these with force-profile graphs. Board Specs iec 60352-5 pdf

Defines tolerances for test boards, including plated-through hole (PTH) characteristics and updated copper thickness limits to match modern manufacturing. Electrical Measurement methods for contact resistance to ensure long-term electrical stability. Test Schedules Two distinct programs: Qualification (testing individual press-in zones) and Application (testing connections as part of a complete component). IEC 60352-5:2012

IEC 60352-5 is the international standard governing solderless press-in connections (often called press-fit) used in electrical and electronic equipment. The current version is Edition 5.0 (2020), which replaced the previous 2012 edition. Overview of the Standard

The standard specifies requirements, test procedures, and practical guidance to ensure that press-fit connections remain electrically stable and mechanically sound under various environmental conditions.

Mechanism: A press-fit connection is formed by inserting a termination (pin) with a compliant "press-in zone" into a plated-through hole of a circuit board.

Purpose: To provide a standardized way to compare test results across different tooling designs and ensure reliability in demanding sectors like telecommunications and automotive. Key Technical Content Use the PDF as a reference during design

Requirements & Testing: Includes test methods for mechanical strength, electrical resistance, and atmospheric resistance (such as humidity and temperature cycling).

Practical Guidance: Contains an informative Annex with assembly and board-design guidance, including hole tolerance ranges and material specifications.

Standardized Reliability: Press-fit technology is noted for being significantly more reliable than traditional soldering in high-stress environments. Recent Changes in Edition 5.0 (2020)

The 2020 revision introduced several significant updates to align with modern manufacturing:

Expanded Scope: The wording was updated from "telecommunication equipment" to more broadly cover "electrical and electronic equipment and components". Terminology and types of connections (crimped

Material Flexibility: Updates reflect the use of a wider range of board materials beyond standard printed circuit boards.

Refined Limits: Mechanical and plating limits were refined to match current industrial practices. Accessing the PDF

The full document is a copyrighted technical standard and typically requires purchase from authorized distributors: IEC 60352-5:2020 - iTeh Standards

How to use the PDF version of IEC 60352-5 effectively

  • Use the PDF as a reference during design reviews, test-plan creation, and supplier audits.
  • Cross-reference the standard’s test methods with in-house test rigs to ensure procedures match required sample sizes and test parameters.
  • Extract relevant clauses (e.g., tensile test method, acceptable pull-out force) when writing assembly work instructions and QC checklists.
  • Keep revision history notes—check the PDF’s edition and publication date to ensure you’re applying the correct version for regulatory needs.

3. Key Parameters Defined by IEC 60352-5

| Parameter | Requirement (Typical) | |-----------|----------------------| | Wire diameter | 0.1 mm to 1.0 mm (extensions for 1.5 mm by agreement) | | Terminal material | Cu-alloy, steel, or brass, typically tin or silver plated | | Number of turns | Minimum: 1.5 (starts: see standard fig.) | | Winding tension | Defined but depends on wire material and diameter | | Post condition | No burrs, correct hardness (typically HV 80–130) |

What the standard covers (high level)

  • Terminology and types of connections (crimped, wire-to-wire, wire-to-terminal).
  • Requirements for joint construction and acceptable defects.
  • Test methods: tensile strength, pull-out force, contact resistance, endurance (vibration/cycling), solderability where applicable, and environmental stress tests.
  • Inspection and sampling procedures.
  • Acceptance criteria and reporting formats.

Option 1: Purchase Directly from the IEC Webstore

  • Website: webstore.iec.ch
  • Search: Enter "60352-5"
  • Format: PDF download (watermarked for security) or hard copy.
  • Cost: Typically between 150 – 300 CHF (Swiss Francs), depending on your country's reseller.
  • Validity: Immediate official version.

Why is this standard important?

Press-in connections offer several advantages over soldering:

  • No thermal stress – Avoids heat damage to components or boards.
  • Repairable – Pins can be extracted and replaced.
  • Higher reliability – Especially in high-vibration or high-temperature environments (e.g., automotive, industrial controls).

Manufacturers, quality engineers, and PCB assemblers use IEC 60352-5 to validate that press-fit technology meets safety and performance benchmarks.